Position:SS-H series

99.9% High Purity 1um Spherical Silica Powder SS-H series

Product Parameter:

Purity:

SiO2 > 99.9%

Size:

D50 = 1.0 ± 0.2um

Spherical Rate:

≥ 95%

S.S.A.:

6 ± 2 M2/g

High Light:

High Purity; Monodisperse; Sub-Micro


Product Description:

Sub-Micro High Purity Spherical Silica Powder

SS-H-1

 

Introduction:

This product with high spherical rate and high purity.The particle size and distribution can be adjustable.The product has been successfully applied to EMC, CCL and other fields as filling material, which can greatly improve the rigidity, wear resistance, weather resistance, impact resistance, tension resistance, fire resistance, arc insulation resistance and ultraviolet radiation resistance of electronic products.

 

Characteristic: SiO2  >  99.9% 

 

Application: EMC, CCL, Photovoltaic crucible Coating, Special Coating, Ink, Special Ceramic Materials, Engineering plastics,etc.

 

Product Parameter:

ITEM Unit SS-H-1
Particle Size(D50) um 1.0 ± 0.2
Spherical rate % > 95
Whiteness -- > 92
SiO2 % > 99.9
Density g/cm3 > 2.2
S.S.A. m2/g 6 ± 2

Above specification are for common uses,and can be adjusted upon user’s request.


Parameters Table:
Sub-Micro High Purity Spherical Silica Powder 
SS-H series
Product Type and Data:
ITEM Unit SS-H-03 SS-H-05 SS-H-1
Particle Size(D50) um 0.3 ± 0.1 0.5 ± 0.1 1.0 ± 0.2
Spherical rate % > 95 > 95 > 95
Whiteness -- > 92 > 92 > 92
SiO2 % > 99.9 > 99.9 > 99.9
Density g/cm3 2.1 ± 0.1 2.1 ± 0.1 > 2.2
S.S.A.  m2/g 15 ± 5 15 ± 5 6 ± 2


Application:

Applications:

EMC, CCL, Photovoltaic crucible Coating, Special Coating, Ink, Special Ceramic Materials, Engineering plastics,etc.